Semiconductor Integrated Circuit Manufacturing Manual

Author: Geng Huaiyu
Publisher:
Publish Date: 2006-12-01
Features: This book is a highly comprehensive reference, written by 60 international experts and reviewed by an equally qualified advisory group. It covers the fundamental knowledge of related technologies, practical applications in real-world scenarios, and operational management considerations such as the planning, implementation, and control of production processes. It encompasses manufacturing processes and auxiliary facilities—from the preparation of raw materials to packaging and testing, from basic principles to new technologies. For optimized design and best manufacturing processes, it provides essential information for achieving low-cost manufacturing of high-quality chips. The book introduces new information on semiconductor wafer processes, MEMS, nanotechnology, and flat displays, as well as advanced production and automation technologies. It includes yield management, material automated transport systems, the design and operational management of wafer fabs and cleanrooms, gas removal, and waste management. The extensive coverage makes this book the most comprehensive single-volume reference in the semiconductor field. Based on its broad scope, the book is highly versatile, suitable for both faculty, students, and researchers in academic institutions and professionals in the semiconductor industry engaged in production and management.