Integrated circuit manufacturing process

Author: Lin Mingxiang
Publisher:
Publish Date: 2005-10-01
Features: This book is written based on the characteristics of higher vocational education and is a teaching material that integrates the principles of semiconductor manufacturing technology and manufacturing techniques. Since silicon devices occupy the vast majority of microelectronics, this textbook takes silicon planar technology as the main line while also introducing other technologies such as gallium arsenide. The book consists of 15 chapters, covering the preparation of silicon single crystals; thin-film preparation technologies such as epitaxy, oxidation, sputtering (evaporation), and chemical vapor deposition; doping technologies such as diffusion and ion implantation; graphic processing technologies such as mask making, photolithography, etching, and CAD; metallization and planarization, assembly engineering, product reliability, as well as peripheral processing technologies such as cleanroom technology and deionized water preparation. This book is suitable as a teaching material for relevant majors in higher vocational and technical colleges of electronic information technology, and also as a training textbook for intermediate and advanced technical workers in the microelectronics industry.