Modern Electroplating (4th Edition)

Author: (US) Schlesinger
Publisher:
Publish Date: 2006-08-01
Features: The publication of the third edition of Modern Electroplating has passed a quarter of a century, and electrochemical deposition has developed into a mature discipline with many new and potential applications. To describe these developments, the fourth edition of Modern Electroplating invites experts from Canada, the United States, Japan, Germany, and other regions (completely different from the authors of the third edition) to present readers with a comprehensive monograph on electroplating. The new edition covers a wide range of marginal topics, from semiconductor electroplating to environmental research. The fourth edition is suitable for professionals with practical experience in electroplating and also for beginners. It provides clear, complete, new principle explanations, as well as applications of closely related electroplating technologies. It not only replaces the third edition as an effective reference source for electroplating processes but also shifts the focus to the electronics industry, from physical methods to electrochemical methods, particularly regarding the technology of second-generation products, such as copper interconnection technology. The content includes:
- Electroplating of various metals and alloys
- Semiconductor electroplating and insulator electroplating
- Electrodeposition of conductive polymers
- Chemical plating of various metals and alloys
- Pre-treatment processes for electroplating
- Production technology, monitoring, testing, and control of electroplating
- Electroplating and the environment
This book systematically introduces the fundamental principles of electrochemical deposition, including the electrodeposition of various metals and alloys, semiconductor electroplating and insulator electroplating, and the electrodeposition of conductive polymers.