Modern Electroplating - (4th Edition) (4th Edition)

Author: Schlegel
Publisher:
Publish Date: 2006-08-01
Features: The publication of the third edition of Modern Electroplating has passed a quarter of a century, and electrochemical deposition has developed into a mature discipline with many new and potential applications. To describe these developments, the fourth edition of Modern Electroplating invites experts from Canada, the United States, Japan, Germany, and other regions (completely different from the authors of the third edition) to present readers with a comprehensive monograph on electroplating. The new edition covers a wide range of marginal topics, from semiconductor electroplating to environmental research. The fourth edition is suitable for professionals with practical experience in electroplating and also for beginners. It provides clear, complete, and new explanations of principles, as well as the application of closely related electroplating technologies. It not only replaces the third edition as a very effective reference source for electroplating processes but also shifts the focus to the electronics industry, from physical methods to electrochemical methods, particularly regarding second-generation product technologies, such as copper interconnection technology. The content includes:
- Electroplating of various metals and alloys
- Electroplating of semiconductors and insulators
- Electrodeposition of conductive polymers
- Chemical plating of various metals and alloys
- Pre-plating pretreatment processes
- Production technology, monitoring, testing, and control
- Electroplating and the environment
The publication of the third edition of Modern Electroplating has passed a quarter of a century, and electrochemical deposition has developed into a mature discipline with many new and potential applications. To describe these developments, the fourth edition of Modern Electroplating invites experts from Canada, the United States, Japan, Germany, and other regions (completely different from the authors of the third edition) to present readers with a comprehensive monograph on electroplating. The new edition covers a wide range of marginal topics, from semiconductor electroplating to environmental research. The fourth edition is suitable for professionals with practical experience in electroplating and also for beginners. It provides clear, complete, and new explanations of principles, as well as the application of closely related electroplating technologies. It not only replaces the third edition as a very effective reference source for electroplating processes but also shifts the focus to the electronics industry, from physical methods to electrochemical methods, particularly regarding second-generation product technologies, such as copper interconnection technology. The content includes:
- Electroplating of various metals and alloys
- Electroplating of semiconductors and insulators
- Electrodeposition of conductive polymers
- Chemical plating of various metals and alloys
- Pre-plating pretreatment processes
- Production technology, monitoring, testing, and control
- Electroplating and the environment