Author: Zhou Yuaxing
Publisher:
Publish Date: 2003-07-01
Features: Integration of CMOS/BiCMOS process technologies, including various factors considered during manufacturing, advanced isolation techniques, and through-metalization solutions; device performance and modeling, including new bipolar models such as HICUM, MEXTRAM, VBIC, as well as important MOS models like EKV, BSIM, Philips, and MOS9; in-depth comparison of circuit technologies, structures, and characteristics for single-cell operation; alarm transistor placement: a new technology for designing low-voltage, low-power latches and triggers.
Low-voltage low-power CMOS/BiCMOS VLSI
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