Introduction to Microfabrication

Author: (Finland) Franssila (Franssila/S.) / Chen Di et al
Publisher:
Publish Date: 2006-01-01
Features: The 21st century will be a new era of continuous development for microelectronics technology and its related industries. This book introduces various aspects of microfabrication from the perspective of microprocessing, including materials, basic processes, structures, process integration, equipment, and manufacturing. The materials section covers silicon, thin film materials, their preparation processes, and structures. The basic processes section includes thin film preparation, epitaxy, lithography, etching, thermal oxidation, diffusion, ion implantation, chemical mechanical polishing (CMP), bonding, casting, and stamping. The structures section covers self-alignment structures, plasma etching structures, wet etching silicon structures, sacrificial layer structures, and deposition structures. The process integration section includes complementary metal-oxide semiconductor (CMOS) transistor fabrication, bipolar technology, multilayer metallization, and microelectromechanical systems (MEMS). The equipment section covers thermal processing, vacuum and plasma, chemical vapor deposition, and epitaxy equipment. It also introduces cleanrooms, yield, wafer fabs, Moore's Law, and other aspects related to microfabrication technology. This book not only covers microelectronics manufacturing processes but also touches on microelectromechanical systems, microfluidics, micro-optics, and nanotechnology. It serves as an excellent textbook for students in fields such as electronic engineering, chemistry, mechanical engineering, physics, and materials science to learn about microstructures and microfabrication techniques. It can be used for microelectronics, microelectromechanical systems, optoelectronics, or related emerging fields.