Microelectronics Materials and Processes

Author: Chen Lijun
Publisher:
Publish Date: 2005-03-01
Features: Simplified Chinese Version
Publisher's Preface
The book "Microelectronic Materials and Processes" was brought into the schedule of translation and publication in the simplified Chinese version in midsummer of 2004, thanks to the strong promotion by Dr. Hsieh Yongfen of Macrocom Technology Co., Ltd. in Taiwan and the strong support from the Taiwan Materials Science Society. Fudan University Press is deeply grateful to our Taiwanese friends for their trust and support. During the publishing process, the book received great help from the Department of Microelectronics at Fudan University. On this occasion, we express our heartfelt gratitude. Professor Li Bingzong, Professor Ru Guoping, and Associate Professor Qu Xinping provided valuable expert opinions for the introduction of this book in their busy schedules. Associate Professor Lin Yin and Engineer Zhang Junying arranged discussion meetings about the book on their days off, which we will never forget. Miss Yang Yan of Industrial IC (Shanghai) Co., Ltd. did a lot of specific and meticulous work for the introduction and publication of this book. Mr. Yang Dongjin of Fuchin Microelectronics Technology Consulting Co., Ltd. was responsible for the editing and proofreading of this book and read the proofs in a timely manner. Mr. Guo Shouyi of Industrial IC also put in a lot of effort during the process of taking over this project. Without their efforts, it would have been difficult for us to present this book to readers in such a short time. The support from Industrial IC and Fuchin Microelectronics is also one of the reasons why we were able to publish the simplified Chinese version as soon as possible. Considering that the target readers of this book are undergraduate and graduate students in the field of microelectronics and engineers in related fields, the process of creating the simplified Chinese version of this book completely replicated and retained the treatment of figures and references from the version published by Yingjie Enterprise Co., Ltd. in Taiwan. Since each chapter was written by different authors, some translated English terms in the figures and tables into Chinese, some did not, and some used a mix of Chinese and English. Physical symbols in the text are in boldface letters, and units of measurement follow industry standards. Although this does not conform to the publishing norms in mainland China, for us, doing so allows readers to experience the original style of the book and enables us to publish it more quickly. Therefore, we kindly ask and publishing management departments for their understanding.
We hereby use the publication of this book as the beginning of our cooperation with the Taiwan Materials Science Society and as the beginning of our cooperation with experts and scholars in the field of microelectronics.
Fudan University Press
January 25, 2005