Fundamentals of Microsystem Packaging

Author: Huang Qing'an / Tang Jieying
Publisher:
Publish Date: 2005-02-01
Features: This book is an internationally reference book on microsystem packaging. It includes: fundamental knowledge of microelectronics, photonics, RF, and MEMS; single-chip, multi-chip, and wafer-level packaging technologies for microsystems; IC assembly techniques, circuit board assembly techniques, and packaging materials; electrical performance, thermal performance, and reliability design of microsystem packaging; and also introduces the main application areas of microsystems. The content of the book starts from the basics and systematically and comprehensively introduces microsystem packaging technology. It is suitable for senior undergraduate and graduate students, teachers, and related researchers and engineering professionals in the fields of microelectronics, photonics, RF communication, and MEMS as a professional reference book.