Electronic assembly process

Author: Yang Qingxue
Publisher:
Publish Date: 2003-04-01
Features: This book includes the following content: common technical documents and complete machine assembly processes, common electronic materials, common electronic components and instruments, electronic assembly and connection processes, assembly preparation process foundation, electronic component assembly processes, electronic complete machine total assembly and debugging processes, inspection and packaging processes, etc. Summaries and exercises are provided after each chapter. The book emphasizes fundamentals while striving to reflect new knowledge, new technologies, and new processes. Its content is aligned with the national vocational skill assessment standards, focusing on practicality and the cultivation of students' skills. This book can serve as a textbook for higher vocational electronic and information majors and also as a reference for relevant engineering and technical personnel.