Microelectronics Manufacturing Science Principles and Engineering Technology (Second Edition) (Chinese Version)

Author: (American) Campbell, translated by Zeng Ying, Yan Liren, Wang Jijun, etc.
Publisher:
Publish Date: 2005-08-01
Features: This book systematically introduces the scientific principles and engineering technologies of microelectronics manufacturing, covering all the basic single processes involved in integrated circuit manufacturing, including lithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, vapor phase epitaxy, sputtering, and chemical vapor deposition. For each single process, it not only introduces its physical and chemical principles but also describes the process equipment used in integrated circuit manufacturing. The book also introduces various advanced process technologies, such as rapid thermal processing, next-generation lithography, molecular beam epitaxy, and metal-organic chemical vapor deposition. On this basis, the book discusses how to integrate these single processes into various common integrated circuit process technologies, such as CMOS technology, bipolar technology, and gallium arsenide technology, and also introduces the new field of microelectronics manufacturing, namely microelectromechanical systems and their process technologies. This book can serve as a textbook or reference for undergraduate and graduate students majoring in microelectronics in higher education institutions, and can also be used as a learning reference for professional technicians engaged in integrated circuit manufacturing process technologies.