CMOS Image Sensor Packaging and Testing Technology

Author: Chen Rongting
Publisher:
Publishing Time: Not available
Features: This book first introduces the history and evolution of the entire semiconductor packaging industry, then takes photo-sensitive chips as an example to explain the chip manufacturing process in a wafer factory, the application scope, structure, and various common CMOS module types. Finally, it elaborates on the new technologies and diverse processes in CMOS photo-sensitive testing.