Microsystem Packaging Principles and Technology

Author: Qiu Bixiu
Publisher:
Publish Date: 2006-09-01
Features: Packaging is an interdisciplinary technology. This book comprehensively and systematically introduces packaging technology, aiming to enable readers to fully master this technology. The book is divided into three parts: principle introduction, analysis and testing, and applications. In the principle introduction section, it focuses on electrical design, thermal management, material selection, and process design. In terms of analysis and testing, it introduces various product failure analysis, reliability design, and testing methods. In terms of applications, it covers packaging technologies for different products (including ICs, optoelectronics, MEMS, etc.) and introduces forward-looking packaging and the development trends of packaging technology. This book can serve as a textbook for packaging-related courses in technical and vocational colleges or reference material for self-study and practical use.
Packaging is an interdisciplinary technology. This book comprehensively and systematically introduces packaging technology, aiming to enable readers to fully master this technology. The book is divided into three parts: principle introduction, analysis and testing, and applications. In the principle introduction section, it focuses on electrical design, thermal management, material selection, and process design. In terms of analysis and testing, it introduces various product failure analysis, reliability design, and testing methods. In terms of applications, it covers packaging technologies for different products (including ICs, optoelectronics, MEMS, etc.) and introduces forward-looking packaging and the development trends of packaging technology. This book can serve as a textbook for packaging-related courses in technical and vocational colleges or reference material for self-study and practical use.