Microelectronics Device Packaging - Packaging Materials and Packaging Technology

Author: Zhou Liangzhi
Publisher:
Publish Date: 2006-08-01
Features: China is in an era of vigorous development in the microelectronics industry, and research on microelectronics system packaging materials and packaging technology is also booming. The demand for publications on packaging materials and packaging technology in society is increasing day by day. This book is a systematically comprehensive reading on packaging materials and packaging technology. It is written based on references to current publications on packaging materials and packaging technology, combined with the author's extensive experience in microelectronics packaging work in the United States. This book can serve as a reference for engineering technicians, management personnel, researchers, and educators engaged in microelectronics. It provides a detailed introduction to polymer materials, ceramic materials, metal welding materials, sealing materials, and adhesives used in microelectronics device packaging, elaborates on the packaging manufacturing processes of semiconductor chips and integrated circuit devices, and explains the fundamental theories of electronics and thermodynamics in microelectronics device packaging. This book can serve as a reference for engineering technicians, management personnel, researchers, and educators involved in microelectronics device manufacturing, and can also be used as a textbook for microelectronics majors.