CMOS Image Sensor Packaging and Testing Technology

Author: Chen Rongting / Country: Mainland China
Publisher:
Publish Date: 2006-07-01
Features: This book first introduces the history and evolution of the entire semiconductor packaging industry. Then, using a photodetector chip as an example, it explains the chip manufacturing process in a wafer factory, the application scope, structure, and various common CMOS module types. Finally, it elaborates on the new technologies and diverse processes in CMOS photodetector testing.