Low-cost flip chip technology-DCA.WLCSP and BGA chip mounting technology

Author: (USA) Liu Hancheng
Publisher:
Publish Date: 2006-04-01
Features: This book covers the entire range of low-cost flip-chip technology, from basic principles to cutting-edge developments. The content includes wire bonding and solder bump chip-level interconnection technologies, the physical and mechanical properties of lead-free solders, microvia sequential build-up (SBU) technology for high-density printed circuit boards (PCBs) and substrates, flip-chip-on-board (FCOB) technology using conventional, non-flow, and incomplete underfill solder bumps, applications of flip-chip technology with microvias and via-in-pad (VIP) chip-level packages (CSP), face-down PBGA packaging technology, and failure analysis of flip-chip technology with solder bumps in PBGA packaging. The book also provides a wealth of reference charts and graphs. It is of significant value to R&D personnel and related technical staff working on low-cost flip-chip technology, as well as serving as a valuable teaching reference for undergraduate and graduate students in relevant fields.