Introduction to Microsystem Packaging Technology

Author: Jin Yufeng
Publisher:
Publish Date: 2006-03-01
Features: This textbook attempts to introduce the relevant technologies of microsystem packaging from a systematic and applied perspective, starting from the position of information system technology chain, providing essential foundational knowledge for students and researchers in microsystem technology-related fields such as microelectronics and optoelectronics. The textbook will focus on microelectronics packaging and integration technologies, integrating MEMS packaging technology, RF system packaging technology, and optoelectronic packaging technology, and will introduce them from four levels: ①