Multi-Chip Component Technology Manual

Author: Gary (USA) Trick
Publisher:
Publish Date: 2006-02-01
Features: Multi-Chip Component (MCM) technology is an advanced microelectronics assembly and packaging technology of the modern era. This book comprehensively discusses MCM technology and its latest developments from aspects such as circuit design, material performance, process assembly, packaging thermal design, and testing. It also conducts an in-depth study of the technical characteristics and application fields of MCM, including detailed information on related disciplines such as microelectronics, physics, chemistry, and physical chemistry. This book can serve as a reference for technical personnel engaged in hybrid microelectronics in China, as well as a textbook for undergraduate and graduate students in electronic and microelectronics-related fields at universities and colleges.