Microelectronics Devices and Packaging Strengthening Technology

Author: Yang Ping
Publisher:
Publish Date: 2005-09-01
Features: This book comprehensively and deeply introduces the theory and technology of electronic equipment and device packaging reinforcement systems for complex and harsh environments, catering to the requirements of microelectronics devices and packaging reinforcement. The author integrates closely electronic information, electromagnetism, heat transfer, vibration and shock theory, mathematical theory, computer technology, control theory, nonlinear science, intelligent engineering, chemistry, physics, microelectronics manufacturing, communications, data structures, and material science. It focuses on topics such as an introduction to the working environment of electronic equipment and devices, vibration and shock reduction principles and reinforcement technology, thermal environments and thermal reinforcement design, electromagnetic environments and anti-electromagnetic interference reinforcement technology, electronic packaging reinforcement technology, evaluation, failure, and reinforcement design of microelectronics packaging, and environmental testing technology for microelectronics devices and components. This book is suitable for senior undergraduate and graduate students in fields such as Mechatronics Engineering, Mechanical Engineering and Automation, Computer Science, Communications, Electronic Information Equipment, Mechanics, Automatic Control, Management Engineering, and Environmental Engineering. It can also serve as a reference for scientists, researchers, and designers in relevant research institutes, factories, and enterprises.