Electroplating process and equipment

Author: Feng Liming
Publisher:
Publish Date: 2005-10-01
Features: Electroplating is an important surface engineering technology with significant applications in the fields of machinery and electronics, national defense, and information. This book introduces the theoretical foundation of electrochemistry, single-metal and alloy electroplating processes, electroplating machinery and equipment, electroplating power supplies, and PLC control systems for electroplating production lines. It also briefly covers related theories of electroplating processes and equipment, such as pretreatment processes for electroplating. The book primarily focuses on the theoretical foundation of electrochemistry, single-metal and alloy electroplating processes, electroplating machinery and equipment, electroplating power supplies, and PLC control systems for electroplating production lines. It also briefly introduces pretreatment processes for electroplating, conversion film technologies for different substrates, chemical plating and electrophoresis, dyeing, embossing, and two-color electroplating, among other special surface decoration techniques. This book is suitable for technicians, managers, and workers engaged in electroplating processes, electroplating equipment design and manufacturing, and PLC control system design and debugging. It can also serve as a teaching material for colleges and universities.
Chapter 1 Introduction
1.1 Development Overview of the Electroplating Industry
1.2 Basic Concepts of Electroplating
1.3 Faraday's Law and Its Application in Electroplating
1.3.1 Faraday's Law
1.3.2 Determination of Current Efficiency
1.3.3 Basic Calculations in Electroplating
1.4 Classification of Plating Layers
Chapter 2 Application of Electrochemical Theory in Electroplating
2.1 Polarization of Electrodes
2.1.1 Causes of Polarization
2.1.2 Polarization Curves and Polarization Degree
2.1.3 Determination of Polarization Curves
2.1.4 Application of Polarization Curves in Electroplating
2.1.5 Deposition Potential
2.2 Metal Electrodeposition
2.2.1 Single-Metal Electrodeposition
2.2.2 Coprecipitation of Metals
2.2.3 Crystallization Process of Metals
2.3 Electrode Reactions and Processes
2.3.1 Electrode Reaction Processes
2.3.2 Structural Model of Ionic Double Layers
2.3.3 Electrode Differential Capacitance Curves and Their Applications
2.3.4 Capillary Phenomenon
2.3.5 Adsorption of Active Particles at the Electrode-Solution Interface
2.4 Anodic Processes in Electroplating
2.4.1 Anodes and Passivation in Electroplating
2.4.2 Mechanism of Metal Passivation
2.4.3 Main Factors Affecting Anodic Processes in Electroplating
2.5 Factors Affecting Plating Layer Structure and Distribution
2.5.1 Influence of Plating Solution Composition
2.5.2 Influence of Electroplating Process Specifications
2.5.3 Influence of Hydrogen Evolution
2.5.4 Influence of Substrate Metal on the Plating Layer
2.6 Performance of Plating Solutions
2.6.1 Dispersion Capability of Plating Solutions
2.6.2 Covering Capability of Plating Solutions
2.6.3 Leveling Capability of Plating Solutions
2.6.4 Hull Cell Test
Chapter 3 Pretreatment Surface Processes
3.1 Significance of Pretreatment for Metal Parts
3.2 Smoothing Rough Surfaces
3.2.1 Polishing
3.2.2 Honing
3.2.3 Roll Honing
3.2.4 Brush Honing
3.2.5 Sandblasting
3.3 Degreasing
3.3.1 Degreasing with Organic Solvents
3.3.2 Chemical Degreasing
3.3.3 Electrochemical Degreasing
3.3.4 Ultrasonic Degreasing
3.4 Etching
3.4.1 Chemical Etching
3.4.2 Electrochemical Etching
3.4.3 Ultrasonic Field Etching
3.4.4 Mild Etching
3.5 Electrolytic Polishing of Metals
3.5.1 Mechanism of Electrolytic Polishing
3.5.2 Electrolytic Polishing Solutions and Process Specifications
3.6 New Achievements in Pretreatment Surface Preparation
3.7 Principles for Developing Surface Preparation Process Flows
3.8 Pretreatment for Special Materials
3.8.1 Pretreatment for Stainless Steel
3.8.2 Pretreatment for Zinc Alloy Castings
3.8.3 Pretreatment for Aluminum and Aluminum Alloys
3.8.4 Pretreatment for Magnesium and Magnesium Alloys
3.8.5 Pretreatment for Titanium and Titanium Alloys
3.8.6 Pretreatment for Nonmetallic Materials
3.8.7 Copper Pretreatment for Steel Parts
Chapter 4 Single-Metal and Alloy Electroplating Processes
4.1 Electroplating Zinc and Zinc Alloys
4.1.1 Cyanide Plating Zinc
4.1.2 Alkali Zincate Plating Zinc
4.1.3 Chloride Plating Zinc
4.1.4 Sulfate Plating Zinc
4.1.5 Post-Treatment of Zinc Plating Layers
4.1.6 Electroplating Zinc-Nickel Alloys
4.1.7 Electroplating Zinc-Iron Alloys
4.2 Electroplating Nickel and Alloys
4.2.1 Electrode Process of Nickel Plating
4.2.2 Nickel Plating Process Specifications
4.2.3 Influence of Impurities on Nickel Plating Layers and Methods for Elimination
4.2.4 Removal of Nonconforming Plating Layers
4.2.5 Multi-Layer Nickel Plating
4.2.6 Electroplating Nickel Alloys
4.2.7 Nickel Gilding
4.3 Electroplating Copper and Alloys
4.3.1 Cyanide Plating Copper
4.3.2 Sulfate Plating Copper
4.3.3 Phosphoric Acid Plating Copper
4.3.4 Electroplating Copper-Zinc Alloys
4.3.5 Electroplating Copper-Tin Alloys
4.3.6 Imitation Gold Plating
4.4 Electroplating Chromium
4.4.1 Overview
4.4.2 Electrode Process of Chromium Plating
4.4.3 Composition of Chromium Plating Solution and Process Conditions
4.4.4 Chromium Plating Process
4.4.5 New Developments in Chromium Plating
4.4.6 Causes of Chromium Plating Failures and Troubleshooting
4.4.7 Removal of Nonconforming Chromium Plating Layers
4.4.8 Substitution for Chromium Plating
4.5 Electroplating Tin and Alloys
4.5.1 Acidic Tin Plating
4.5.2 Alkaline Tin Plating
4.5.3 Other Tin Plating Processes
4.5.4 Prevention of Tin Whiskers and Removal of Nonconforming Tin Plating Layers
4.5.5 Electroplating Lead-Tin Alloys
4.6 Electroplating Gold
4.6.1 Overview
4.6.2 Types and Characteristics of Gold Plating Solutions
4.6.3 Gold Recovery
4.7 Electroplating Silver and Alloys
4.7.1 Cyanide Plating Silver
4.7.2 Non-Cyanide Plating Silver
4.7.3 Pretreatment for Silver Plating
4.7.4 Post-Treatment for Silver Plating
4.7.5 Treatment for Discoloration of Silver Plating Layers
4.7.6 Importance of Electroplating Silver in the Electronics Industry—High-Speed Local Silver Plating
4.7.7 Electroplating Silver Alloys
Chapter 5
Chapter 6 Chemical Plating
Chapter 7 Oxidation, Phosphating, and Coloring of Metals
Chapter 8 Electroplating Process Equipment
Chapter 9 Electroplating Power Supplies
Chapter 10 Electrical Control of Electroplating Automated Production Lines
References