Electronic Packaging Engineering

Author: Tian Minbo
Publisher:
Publish Date: 2003-09-01
Features: This book is the third volume in the series "Materials and High Technology Applications." It includes topics such as an overview of electronic packaging engineering, the evolution and advancements of electronic packaging engineering, thin film materials and processes, thick film materials and processes, organic substrates, inorganic substrates, microinterconnection technology, packaging and encapsulation technology, BGA and CSP packaging, the analysis, evaluation, and design of electronic packaging, and the application and development of ultra-high-density packaging. The book begins with the fundamental concepts of microelectronics packaging and its evolution and advancements, providing a detailed discussion on manufacturing processes, related materials, and applications for high-density electronic packaging. The content is suitable for professionals in various fields, including microelectronics, electronic components, semiconductors, materials, computer and communication, chemical engineering, mechanical engineering, and plastic processing. This book can serve as a textbook for undergraduate and graduate students in relevant disciplines, as well as a reference for scientists, engineers, and other technical professionals.