The processing technology of polished silicon single crystal wafer

Author: Zhang Juzong
Publisher:
Publish Date: 2005-08-01
Features: This book adopts a progressive approach in its content, introducing knowledge related to semiconductor silicon and integrated circuits while briefly covering the development and trends of the semiconductor industry, as well as the technology and advancements in silicon single crystals and polished wafers, both domestically and internationally. It focuses on elaborating on the processing and preparation techniques of silicon single-crystal polished wafers, the transportation and handling of large-diameter silicon wafers, the testing of silicon single crystals and polished wafers, cleanroom technology, and waste treatment. Additionally, the book includes numerous figures, tables, and other reference materials for readers. This book is suitable for science and technology professionals dedicated to semiconductor material silicon technology, as well as specialized engineering technicians in the field of silicon single-crystal and polished wafer processing, enterprise management personnel, and workers. It can also serve as a training textbook for enterprises. The book primarily introduces the physical and chemical properties of silicon, its semiconductor characteristics, and the preparation of silicon single-crystal polished wafers for integrated circuits.