Optical Fiber Communication Integrated Circuit Design

Author: Wang Zhigong
Publisher:
Publish Date: 2003-06-01
Features: This book comprehensively discusses the integrated circuit design for optical communication systems, including the following contents: Introduction, Fiber Digital Communication Networks, Fiber Digital Transmission Systems, Signal Analysis in Digital Transmission Systems, Devices and Integrated Circuit Materials and Processes, Transistors, Light Sources and Photodetectors, Passive Devices, Analog Circuits, Digital Circuits, Circuit Design Engineering, Multiplexing and Demultiplexing Circuits, Optical Transmitter Circuits, Optical Receiver Front-End Amplifiers, Clock Recovery Circuits, Data Decision Circuits, Optical Transmitter-Receiver Photonic Integrated Circuits, CAD Technology, High-Speed Integrated Circuit Testing, Bonding and Packaging Technology. This book can be used as a graduate textbook for electronic information and communication majors, and can also be referenced by engineering technicians. [menu] Abbreviations Symbol Table Chapter 1 Introduction Chapter 2 Fiber Digital Communication Networks 2.1 Information, Media, Signals, and Telecommunications 2.2 Digital Communication 2.3 Open System Interconnection's Seven-Layer Model 2.4 PDH 2.5 Local Area Networks (LAN) 2.6 Metropolitan Area Networks (MAN) 2.7 Wide Area Networks and the Internet 2.8 ISDN 2.9 B-ISDN 2.10 Asynchronous Transfer Mode (ATM) 2.11 SDH/SONET References Chapter 3 Fiber Digital Transmission Systems 3.1 Basic Structure of Fiber Transmission Systems 3.2 Data Signal Sources and Signal Multiplexing 3.3 Optical Wave Modulation 3.4 Fibers 3.5 Electronic Repeaters 3.6 Fiber Amplifiers 3.7 Optical Signal Detection—Photodetectors 3.8 Amplifiers in Optical Receivers 3.9 Data Regeneration 3.10 Demultiplexers 3.11 Submarine Cross-Ocean Fiber Cable Transmission Systems 3.12 Optical Soliton Transmission Systems 3.13 All-Optical Communication References Chapter 4 Signal Analysis in Digital Transmission Systems 4.1 Digital Signals 4.2 Clock Signals 4.3 Noise and Interference 4.4 Jitter and Jitter Accumulation 4.5 Measurement of Digital and Clock Signals References Chapter 5 Devices and Integrated Circuit Materials and Processes 5.1 Semiconductor Materials 5.2 Material Systems 5.3 Epitaxy 5.4 Mask Making 5.5 Lithography 5.6 Etching 5.7 Doping 5.8 Insulator Formation 5.9 Metal Layer Formation References Chapter 6 Transistors 6.1 Overview of Transistors 6.2 Bipolar Junction Transistors 6.3 NMOS and CMOS 6.4 MESFET and HEMT References Chapter 7 Light Sources and Photodetectors 7.1 Three Types of Light Sources 7.2 Light-Emitting Diodes 7.3 Laser Diodes 7.4 Optical Modulators and Laser/Modulator Models 7.5 Photodetectors References Chapter 8 Passive Devices 8.1 Interconnects 8.2 Resistors 8.3 Capacitors 8.4 Inductors 8.5 Transformers 8.6 Distributed Elements References Chapter 9 Analog Circuits 9.1 Single-Ended Transistor Configurations 9.2 Differential Transistor Configurations 9.3 Capacitive Coupled Current Amplifiers 9.4 Amplifiers 9.5 Voltage-Controlled Oscillators 9.6 Mixers and Phase Detectors 9.7 Phase Shifters Appendix 1 Expressions for EC3A Circuit Input Resistance and Series Capacitance Appendix 2 Expressions for EC3A Circuit Input Conductance and Parallel Capacitance Appendix 3 Expressions for the Magnitude and Phase of EC3A Circuit Transconductance Appendix 4 Derivation of Equation (9.40) References Chapter 10 Digital Circuits 10.1 Basic Logic Circuits 10.2 Transistor-Transistor Logic (TTL) 10.3 Emitter-Coupled Logic (ECL) 10.4 NMOS Logic Circuits 10.5 CMOS Logic Circuits 10.6 MESFET and HEMT Logic Circuits 10.7 Sequential Logic Circuits References Chapter 11 Circuit Design Engineering 11.1 Analog, Digital, and Mixed Circuits 11.2 Signal Types and Circuit Structures 11.3 Broadband and Narrowband Circuits 11.4 Feedback Techniques 11.5 Frequency Compensation 11.6 Circuit Matching 11.7 Low-Power Design 11.8 Interface Circuits References Chapter 12 Multiplexing and Demultiplexing Circuits 12.1 Basic Structure 12.2 Multiplexers 12.3 Demultiplexers 12.4 Byte Multiplexing and Demultiplexing 12.5 Clock Generation Circuits References Chapter 13 Optical Transmitter Circuits 13.1 Introduction 13.2 Overview of Optical Transmitter Design 13.3 Current Drivers 13.4 Voltage Drivers 13.5 Ultra-High-Speed Laser Diode Voltage Drivers 13.6 CMOS Process Ultra-High-Speed Laser Drivers References Chapter 14 Optical Receiver Front-End Amplifiers 14.1 Basic Structure of Optical Receivers 14.2 Optical Receiver Front-End 14.3 Equalizers and Filters 14.4 Main Amplifiers 14.5 Example of Overall Circuit Design for Optical Receiver Front-End Amplifiers References Chapter 15 Clock Recovery 15.1 Overview of Clock Recovery 15.2 Clock Information Detection 15.3 Clock Recovery Using Passive Filters 15.4 Clock Recovery Using Narrowband Regenerative Dividers 15.5 Clock Recovery Using Synchronous Oscillators 15.6 Clock Recovery Using Phase-Locked Loops 15.7 Clock Recovery Using Synchronous Oscillators with PLL References Chapter 16 Data Decision Circuits 16.1 Basic Structure of Decision Circuits 16.2 Decision Using Instantaneous Values 16.3 Decision Using Average Values 16.4 Decision Using Integral Values 16.5 Decision Circuits Using D Flip-Flops 16.6 Parallel Processing Decision Circuits 16.7 Decision Circuits with Automatic Phase Adjustment References Chapter 17 Optical Transmitter-Receiver Photonic Integrated Circuits 17.1 Demand, Challenges, and Implementation of Fiber Communication Photonic Integrated Circuits 17.1 Demand 17.2 Challenges 17.2 Implementation 17.2 Optical Transmitter Photonic Integrated Circuits 17.3 Optical Receiver Photonic Integrated Circuits References Chapter 18 Integrated Circuit CAD 18.1 Computer-Aided Circuit Simulation for Integrated Circuits 18.2 Layout Design 18.3 Layout Verification 18.4 Submitting Layout Data and Taping Out References Chapter 19 High-Speed Integrated Circuit Testing 19.1 Wafer Testing 19.2 Chip Test Bench 19.3 Chip Contact Methods 19.4 IC Testing After Bonding and Packaging 19.5 Test Systems References Chapter 20 Bonding and Packaging Technology 20.1 Substrates for Fixing and Connecting Chips 20.2 Bonding Technology 20.3 Packaging Technology 20.4 Hybrid Integration and Micro-Assembly Technology 20.5 Lead Distribution Parameters 20.6 Chip Heat Dissipation References