Fundamentals of Electronic Manufacturing Technology (Textbook for General Higher Education Planning in the 21st Century)

Author: Wu Yiping
Publisher:
Publish Date: 2005-07-01
Features: This book introduces the main manufacturing technologies of electronic products, including an overview of electronic manufacturing, chip design and manufacturing technology, interconnection and packaging technology of components, passive component manufacturing technology, optoelectronic packaging technology, MEMS process technology, packaging substrate technology, electronic assembly technology, packaging materials, and microelectronics manufacturing equipment. The book briefly introduces wafer manufacturing, focuses on electronic packaging and assembly technology, and systematically introduces manufacturing processes, related materials, and applications. This book can serve as a textbook for undergraduate and graduate students in related fields such as mechanical engineering, materials and material processing, microelectronics, semiconductors, computer and communication, and chemical engineering. It can also be used as a reference book for and engineering technicians to understand electronic manufacturing technology.