Electronic assembly manufacturing

Author: C.A. Harper (Ed.) / Jia Songquan / Cai Jian / Wang Yuming et al. / Jia Songliang et al. (Proofread)
Publisher:
Publish Date: 2005-02-01
Features: Electronic Assembly Manufacturing is a valuable reference for management personnel, engineers, and anyone seeking to enter the rapidly growing electronic field and benefit from it in the areas of electronic product development, manufacturing, and marketing. Electronic assembly manufacturing is a rapidly developing industry, and this book focuses on the processes and raw materials of electronic assembly manufacturing. The book begins with the development history of electronic assembly manufacturing and the preparation of semiconductor chips, followed by the introduction of IC chip packaging, lamination board manufacturing, the production of single-layer and multi-layer circuit boards of various types, and the installation techniques of components on various circuit boards, as well as soldering materials like lead-free solder and their processes, circuit board cleaning and coating, the manufacturing of flexible and rigid-flexible circuit boards, various types of ceramic substrates and composite materials, the assembly of hybrid circuits and modules. The book also specifically covers environmental issues in electronic assembly manufacturing and relevant U.S. regulations. In addition to extensive data, real-world images, and theoretical analysis, it includes many valuable summaries of practical experience and design rules. This book can serve as a reference for professionals in electronic assembly manufacturing, microelectronics packaging, and related material manufacturing industries, as well as a study guide for graduate students and senior undergraduate students in relevant fields.