Lead-free soldering technology

Author: [Japan] Katsuyoshi Suganuma
Publisher:
Publish Date: 2004-07-01
Features: This book comprehensively and systematically introduces the history of solder, the state diagram and microstructure of solder, the interfacial reactions and microstructure of lead-free solder, the brazing process of lead-free solder, the causes and solutions of solidification defects in lead-free solder, the reliability of lead-free packaging, as well as conductive bonding technology.